Shenzhen pcba printed circuit board assembly smt line

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Product details

Brand Name:	Xingda;	Payment Terms:	L/C,D/A,D/P,T/T,Western Union,MoneyGram;
Place of Origin:	Guangdong China;	Packaging Detail:	1. at buyer's request; 2. inner,vaccum package; 3. outer, standard export carton;
Model Number:	pcb;	Port:	shenzhen / HK ports;
hemodialysis machine PCB assembly:	hemodialysis machines PCB Assembly manufacturer;	Supply Ability:	50000 Square Meter/Square Meters per Month;
shenzhen pcb assembly:	shenzhen pcb assembly;

Welcome to XingDa Electric Technology Co.,Ltd

Xindaxing Electric Technology Co.,LTd

Our Services

We can provide one-stop service:

1. PCB circuit boards+Assembly

2. E-test.

3.Electronic components purchasing.

4. PCB assembly: available on SMT, BGA, DIP.

5. PCBA function test.

6. Enclosure assembly.

PCB product Capacity

PCB Manufacture Capacity
Item	Specification
Material	FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.
Remarks	High Tg CCL is Available(Tg>=170℃)
Finish Board Thickness	0.2 mm-6.00mm(8mil-126mil)
Surface Finish	Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Shape	Routing,Punch,V-cut,Chamfer
Surface Treatment	Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)
	Silkscreen(black, yellow, white)
	Peel able-mask(red, blue, thickness>=300um)
Minimum Core	0.075mm(3mil)
Copper Thickness	1/2 oz min; 12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter for CNC Drilling	0.1mm(4mil)
Min Hole Diameter for Punching	0.6mm(35mil)
Biggest panel size	610mm * 508mm
Hole Position	+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)	+/-0.05mm(2mil) or +/-20% of original
Hole Diameter(H)	PTHL:+/-0.075mm(3mil)
Hole Diameter(H)	Non PTHL:+/-0.05mm(2mil)
Outline Tolerance	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Insulation Resistance	10Kohm-20Mohm
Conductivity	<50ohm
Test Voltage	10-300V
Panel Size	110 x 100mm(min)
Panel Size	660 x 600mm(max)
Layer-layer misregistration	4 layers:0.15mm(6mil)max
Layer-layer misregistration	6 layers:0.25mm(10mil)max
Min spacing between hole edge to circuitry pattern of an inner layer	0.25mm(10mil)
Min spacing between board outline to circuitry pattern of an inner layer	0.25mm(10mil)
Board thickness tolerance	4 layers:+/-0.13mm(5mil)

Flexible PCB product Capacity

FPC Tech Specification
Items	Capabilities
Layers	FPC:1 to 6 Layers, Rigid Flex: 2 to 10 Layers
Regular Base Materials	Kapton,Polyimide(PI), Polyester(PET),
Base Copper Thickness	1/3 oz to 8oz
Regular Base Material Thickness	12.5um to 50um(FPC)
Regular Base Material Thickness	0.1mm to 3.2mm(Rigid)
Regular Coverlay Thickness	27um to 50um
Regular Adhesive Thickness	12um to 25um
Blind or Buried Vias	Yes
Impedance Control	Yes
Min.Line Width/Spacing	0.04mm/0.04mm
Surface Finishing	Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP
Outline Fabrication	Die cut, laser cut, CNC routing, V-scoring
Hole to edge(Hard tool/Die Cut)	±0.1/±0.2mm
Edge to edge(Hard tool/Die Cut)	±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)	±0.07/±0.2mm

PCB Assembly(SMT) Product Capacity

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01mm
Assembly capacity	≥8 million piots/day
DIP capacity	6 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.