port: | Shenzhen/Guangzhou | Minute line width: | 0.3-0.35um |
Plate thickness: | 0.7-1.6 mm | application: | Electronic equipment |
product name: | circuit board | place of origin; place of origin: | Guangdong, China |
Serve: | Provide OEM service | payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram |
Minute line spacing: | 0.3-0.35um | Types of: | Electronic board |
usage: | Foundry Electronics | model: | HM-LV10189 |
Copper thickness: | 15-35 microns | Packaging Details: | Carton |
Minute Hole Size: | 0.3-5mm | Certificate: | CUL/ROHS/ISO9001 |
Package preview: | Substrate: | aluminum material | |
Supply capacity: | 50000000 pieces per month | thing: | custom circuit board |
Name: | Projector aluminum substrate | Surface treatment: | HASL/ENIG/OSP/Immersion Silver |
Solder Mask: | green. blue. | Material: | aluminum material |
High Quality 9W High Voltage SMD 2835 AC220V LED Round Ink Printing Aluminum LED PCB For Tube Light
PCB capacity | |
Substrate | FR-4, 22F, CEM-3, CEM-1, Aluminum, HB, 94V0 |
layers | 1-22 floors |
largest panel | 1550mm*800mm |
copper thickness | 0.5oz, 1oz, 2oz, 3oz, 4oz |
Dielectric thickness | 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm |
Core thickness | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 3.2mm |
plate thickness | 0.4mm - 4.0mm |
Thickness Tolerance | +/-10% |
aluminum processing | Drilling, Tapping, Milling, Milling, Die, Break off tabs available |
smallest hole | 0.2 mm |
working voltage | 2.5kVDC (0.075mm dielectric), 3.75kVDC (0.15mm dielectric) |
Minimum track width | 0.2 mm (8 million) |
Minimum Track Clearance | 0.2 mm (8 million) |
Minimum SMD pad pitch | 0.2 mm (8 million) |
surface treatment | HASL lead-free, immersion gold, immersion silver |
Solder mask color | green, blue, etc. |
legend color | black, white, etc. |
electronic quiz | yes |
Certificate | UL/CUL/ROHS/ISO9001 |
PCB assembly capability | |
Minimum IC pitch | 0.2mm |
Minimum Die Size | 0201(0.2x0.1)/0603(0.6x0.3mm) |
Maximum BGA size | 74x74mm |
BGA pitch | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter | 0.40mm (minimum), 1.00mm (maximum) |
QFP Lead Spacing | 0.38mm (minimum), 2.54mm (maximum) |
volume | One piece to small batch production Low-Cost First Article Construction arrange delivery |
Assembled | Surface Mount (SMT) Assembly DIP assembly Hybrid (Surface Mount and Through Hole) Technology Single or double sided placement cable assembly |
Parts procurement | Turnkey (we provide parts) Shipping (you provide the parts) You supply some parts, we do the rest |
Solder type | Leaded Lead-free/ROHS Compliant |
other abilities | Repair/Rework Services mechanical assembly boxed Mold and Plastic Injection |