MOQ: | 1 | type: | High frequency circuit board |
Minute line spacing: | 3000000 | Origin: | Guangdong, China |
Substrate: | Shengyi, DuPont, PI | Serve: | 24 hours technical service |
Packaging Details: | PCB PCBA Manufacturing,Flexible PCB Electronic Circuit Board PCB Assembly PCB: Vacuum Packing with Carton Box PCBA: ESD Packing with Carton Box | Board Dimensions: | Custom PCB Dimensions |
Supply capacity: | 150,000 square meters per year | Key words: | High frequency circuit board |
Minute Hole Size: | 0.1-6.5mm | Product quotation: | within 2 hours |
Sample delivery: | within 24 hours | Package preview: | |
port: | Shenzhen/Guangzhou | Printed Circuit Board Standards: | IPC-A-600 |
model: | High frequency circuit board | Solder Mask: | Green solder mask/black PI/yellow PI |
Copper thickness: | 0.5-2oz | payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram, Alipay |
Surface treatment: | ENIG,HASL,OSP,ENEPIG,Flash Gold | brand: | Summit Electronics Co., Ltd. |
Minute line width: | 3000000 | Plate thickness: | 0.1-0.5mm |
Maximum number of layers: | 8L | legend: | white, black, red, yellow |
Fast delivery low cost pcb manufacturing POE OEM manufacturing pcb board rigid flex high frequency pcb
thing | boring | flexible | rigid-flexible |
Maximum number of layers | 60L | 8L | 36L |
Inner layer minimum trace/space | 3/3 million | 3/3 million | 3/3 million |
Minimum trace/space on outer layers | 3/3 million | 3.5/4 million | 3.5/4 million |
Inner Layer Maximum Copper | 6 oz | 2 oz | 6 oz |
outer layer copper | 6 oz | 2 oz | 3 oz |
Minimal Mechanical Drilling | 0.15mm | 0.1mm | 0.15mm |
Minimal Laser Drilling | 0.1mm | 0.1mm itemRIGIDFLEXRIGID-FLEX | 0.1mm |
Aspect Ratio (Mechanical Drilling) | 20:1 | 10:1 | 12:1 |
Aspect Ratio (Laser Drilled) | 1:1 | / | 1:1 |
Press hole tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
PTH tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
NPTH tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
countersunk tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
plate thickness | 0.4-8mm | 0.1-0.5mm | 0.4-3mm |
Plate thickness tolerance (<1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
Plate thickness tolerance (≥1.0mm) | ±10% | / | ±10% |
Impedance tolerance | Single-ended: ±5Ω (≤50Ω), ±7% (>50Ω) | Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) | Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) |
Differential: ±5Ω (≤50Ω), ±7% (>50Ω) | Differential: ±5Ω (≤50Ω), ±10% (>50Ω) | Differential: ±5Ω (≤50Ω), ±10% (>50Ω) | |
Minimum board size | 10*10mm | 5*10mm | 10*10mm |
board size | 22.5*30 inches | 9*14 inches | 22.5*30 inches |
Profile Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
Minimum BGA | 7 million | 7 million | 7 million |
Minimum SMT | 7*10 million | 7*10 million | 7*10 million |
surface treatment | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating |
Solder mask | Green, black, blue, red, matte green | Green solder mask/black PI/yellow PI | Green, black, blue, red, matte green |
Minimum Solder Mask Clearance | 1.5 million | 3000000 | 1.5 million |
Minimum Solder Dam | 3000000 | 800w | 3000000 |
legend | white, black, red, yellow | white, black, red, yellow | white, black, red, yellow |
Minimum legend width/height | 4/23 million | 4/23 million | 4/23 million |
Strain Fillet Width | / | 1.5±0.5mm | 1.5±0.5mm |
bow and twist | 0.30% | / | 0.05% |