USB Phone Fast Charger Pcba PCB Assembly

layers

1-18 floors

Material

fr4, Tg=135, 150, 170, 180, 210, cem-3, cem-1, al base, rogers, nelco

copper thickness

1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz

plate thickness

8-236mil (0.2-6.0mm)

Minimum Line Width/Space

3/3 million (75/75um)

Drilling size in minutes

8 million (0.2 mm)

HDI laser drill size in minutes

3 million (0.067mm)

Aperture Tolerance

2 million (0.05mm)

PTH copper thickness

1 million (25 microns)

Solder mask color

custom made

Strippable solder mask

Yes

surface treatment

HASL(ROHS), ENING, OSP, immersion silver, immersion tin, flash gold

gold thickness

2-30u" (0.05-0.76um)

Blind/Buried vias

Yes

V-cut

Yes

technology

surface mount, four-way

SMT capability

4,000,000 points per day

DIP capability

600,000 points per day

experience

QFP, BGA, μBGA, CBGA

process

lead-free

programming

Yes

Conformal Coating

Yes