12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

Supplier: Zhengzhou TCH Instrument Co., Ltd.
Region: Henan, China
Contact: Ms Dorry Chang
Price: $900.00 /set
Min. Order: 1 set

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Product details

Power (kW):	1	After-sales service provided:	On-site installation, commissioning and training, on-site maintenance and repair services, online support, free spare parts, video technical support
brand:	TCH	Warranty:	1 year
Supply capacity:	300 sets per month	Weight (kg):	75
payment terms:	L/C, T/T, Western Union, MoneyGram	Applicable industries:	Precision grinding machine
product name:	12" Precision Automatic Grinding/Polishing Machine	Main selling points:	Sustainable
Local service location:	not any	port:	Chinese port
Packaging Details:	Standard export packaging	After warranty service:	online support, spare parts
Showroom location:	not any	Health status:	new
Origin:	Henan, China

12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

Product Description

UNIPOL-1202The machine is equipped with a 12" ultra-flat grinding disc, which can be used as a high-precision grinding machine for polishing crystal components, semiconductor wafers and ceramic substrates up to4" diameter. It can also be used as a standard grinding and polishing machine for metallographic sample preparation.

Specifications for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

strength	AC 110V and 208-240V (50/60Hz) switchable worldwide.
feature	One cast iron plate for grinding and one cast aluminum plate for polishing. Two rocking stations with wafer holders and conditioning rings that can be independently controlled to simultaneously polish 2 pieces of 4" wafers. Includes complete accessories ready for immediate use
Extra Flat 12" (300 mm) Diameter Grinding Disc	Flatness < 0.25 µm/in²
Precision Rotary Shaft	Bleed < 5 microns
Heavy-duty cast aluminum housing with varnish	Color: black or white
Two workstations with 8° swing and adjustable speed	8" swing, 0-9 swings/minute adjustable
Two flat sample holders for carrying < 4" diameter wafers	Diameter 105 x 35 mm
two condition rings	120 OD x 110 ID x 32 T mm
Digital display main disc speed change	0 ~ 125 rpm
Adjustable timer with automatic stop	0 - 99 hours
engine	300 W high torque DC motor
aspect	700 L x 475 W x 300 H (mm)
weight	154 lbs
Optional automatic slurry feeder	Automatic slurry feeder SKZD-2 is not included. The plastic rolling container holds up to 1.0 gallons (~3.8 L) of slurry for extended polishing.
Shipping size	40"x30"x26"
Shipping weight	245 lbs
optional parts	2" Polishing Fixture for Precision/Automated Thinning and Polishing
obey	CE certification NRTL certification is temporarily unavailable.
Warranty	One year limited, lifetime support Rust and damage caused by improper storage conditions or maintenance are not covered by the warranty

Reference for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

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