brand: | Processing | layer: | From single side to more than 12 layers |
payment terms: | L/C, D/A, D/A, wire transfer | Solder mask color: | Blue, green, red, black, white, etc. |
type: | Rigid-flex board | minute. Line width: | 0.1mm |
port: | Shenzhen Port | Copper thickness: | 1 oz |
maximum. Aspect ratio: | 13:1 | application: | Electronic equipment |
Supply capacity: | 1000 pieces per day | Test service: | 100% |
minute. Line spacing: | 0.1mm | Packaging details: | Inner: vacuum packaging or anti-static packaging, outer: export carton |
Plate thickness: | 1.6mm | minute. Hole size: | 0.2mm |
Surface treatment: | ENIG OSP Hasl | Board size: | custom made |
Place of origin: | Guangdong, China, Guangdong, China | model: | Custom PCB, RM-P0420 |
Serve: | One-stop service | Surface treatment: | Lead-free spray tin, immersion tin, tin plating, OSP, carbon, platinum, immersion gold, etc. |
Supplier type: | Processing | Base material: | FR-4PI |
Package preview: |
quantity | Prototype and volume PCB assembly |
Assembly type | SMT and through hole |
Solder type | Water-soluble solder pastes, leaded and lead-free |
Element | Passive component sizes as small as 0201 BGA and VF BGA Leadless Chip Carrier/CSP Double-sided SMT assembly Fine pitch to 08 mils BGA Repair and Ball Grafting Parts removal and replacement - same day service |
Bare board size | Minimum: 0.25*0.25 inches; Maximum: 20*20 inches |
file format | Bill of Materials (BOM) Gerber file Pick and place files (XYRS) |
Service type | Turnkey, Partial Turnkey or Consignment |
Component packaging | Cut the tape tube reel loose parts |
Turn time | Same day service to 15 days service |
test | Flying probe test XRAY detection, AOI testing |
PCB+assembly process | Drilling-----Exposure----Electroplating-----Etching and Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering ----.Assembly-----ICT-----Functional test-----Temperature and humidity test |
Number of layers | From single side to more than 12 layers |
Copper thickness | 0.5-6 ounces |
Material | FR4 (China Shengyi, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola, etc. |
solder mask | Green, yellow, white, blue, black, red, etc. |
Finished surface | Conventional spray tin, lead-free spray tin, immersion gold, immersion gold (hard gold, soft gold), immersion silver, silver plating, lead-free, spray tin), immersion tin, tin Electroplating, OSP, carbon, platinum, ENENIG... |
Silk screen color | white, black |
product type | HF (high frequency) & (radio frequency) board, impedance control board, HDI board, BGA & fine pitch board |
minute. line width/gap | 3.5/4mil (laser drilling) |
minute. hole size | 0.15mm (mechanical drill)/4mil (laser drill) |
minute. annular ring | 4 million |
Maximum copper thickness | 6 ounces |
Minimum solder mask bridge | 0.08 mm |
Plugging ability | 0.2-0.8 mm |