Min. Line Width: | 0.1mm; | Packaging Detail: | Buble Bag/Vacuum Package/Pearl wool and Carton; |
Surface Finishing: | HASL; | Place of Origin: | Guangdong China; |
Solder Mask: | Green; | Certificate: | ROHS. CE; |
Model Number: | TH-PCB-723; | Board Size: | 800mmx600mm; |
Supply Ability: | 30000 Square Meter/Square Meters per Month; | PCBA Test: | X-ray,AOI Test,Functional test; |
Board Thickness: | 1.6mm; | Port: | Shenzhen; |
Product Name: | Double-sided PCB; | Base Material: | FR-4; |
Copper Thickness: | 1oz; | Type: | Double-sided PCB; |
Number of Layers: | 2 Layer; | Brand Name: | TH; |
Min. Hole Size: | 0.2mm; | Min. Line Spacing: | 0.1mm; |
PCB Test: | Test-rig,Flying Probe Test; | Silkscreen: | White; |
Payment Terms: | L/C,Western Union,T/T,MoneyGram,Paypal; |
Item | Specification | |
1 | Numbr of Layer | 1-18Layers |
2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
3 | Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
4 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
5 | Copper Thickness | 1/2 oz min;12 oz max |
6 | Solder Mask | Green/Black/White/Red/Blue/Yellow |
7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
8 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
9 | Min.Hole Diameter for punching | 0.9mm(35mil) |
10 | Biggest panel size | 610mm*508mm |
11 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
12 | Conductor Width(W) |
0.05mm(2mil)or; +/-20% of original artwork |
13 | Hole Diameter(H) |
PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
14 | Outline Tolerance |
0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
15 | Warp & Twist | 0.70% |
16 | Insulation Resistance | 10Kohm-20Mohm |
17 | Conductivity | <50ohm |
18 | Test Voltage | 10-300V |
19 | Panel Size | 110×100mm(min);660×600mm(max) |
20 | Layer-layer misregistration |
4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
21 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
22 | Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
23 | Board thickness tolerance |
4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
24 | Impedance Control | +/-10% |
25 | Different Impendance | +-/10% |