Packaging Details: | Standard vacuum packaging | minute. Hole size: | 1.6mm,0.25mm |
place of origin; place of origin: | Guangdong, China | color: | white black green red blue yellow |
brand: | trading platform, trading platform | model: | TES-YE031 |
inner packaging: | Vacuum packing, plastic bag | payment terms: | T/T, Western Union |
Copper Thickness: | 0.5 oz; 1.0 oz; 1.5 oz; 2 oz, 1.5 oz | Substrate: | FR4,FR4 |
port: | Shenzhen | minute. Line spacing: | 0.2mm,0.2mm |
Surface treatment: | OSP/ENIG, OSP ENIG | Plate thickness: | 0.6MM;0.8MM;1.0MM;1.6MM,1.6mm |
Supply capacity: | 1,200,000 pieces/month | Packaging Preview: | |
minute. Line width: | 0.2mm,0.2mm |
picture | |
Minimum trace width (a) | 0.075mm (3mil) |
Minimum space width (b) | 0.1 mm (4 million) |
smallest ring | 0.1 mm (4 million) |
Patch pitch (a) | 0.2 mm (8 million) |
BGA spacing (b) | 0.2 mm (8 million) |
Solder mask | |
Minimum solder mask (1) | 0.0635 mm (250,000) |
Solder mask clearance (b) | 0.1 mm (4 million) |
Minimum SMT pad pitch (c) | 0.1 mm (4 million) |
Solder mask thickness | 0.0007 in (0.018 mm) |
hole | |
Minimum Bore (CNC) | 0.2 mm (8 million) |
Minimum punch size | 0.9 mm (35 million) |
Bore Tolerance (+/-) | PTH: ±0.075mm; NPTH: ±0.05mm |
Hole Position Tolerance | ±0.075mm |
plating | |
tin spray | 2.5 microns |
Lead-free tin spray | 2.5 microns |
Shen Jin | Nickel 3-7um Au:1-5u'' |
operating system | 0.2-0.5um |
outline | |
Panel Contour Tolerance (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
chamfer | 30°45° |
golden finger | 15° 30° 45° 60° |
Certificate | ROHS, ISO9001:2008, SGS, certificate |