Packaging Details: | Bubble bag | minute. Hole size: | 0.1 |
Layers: | 2~24L any layer | Plate thickness: | 0.4mm~3.0mm |
minute. Line spacing: | 0.05mm | Supply capacity: | 1,000,000 pieces/month |
place of origin; place of origin: | Guangdong, China | application: | Automotive, Industrial, Medical, Datacom, Consumer |
payment terms: | Western Union, wire transfer | type: | high density circuit board |
Special technique 2: | 6.heatsink 7.Countersink 8.Hybrid Stackup 9.Anylayer | brand: | cathode ray tube |
Serve: | OEM/DFM | Special technique 1: | 1. Impedance 2. Via Fill 3. PFH, Backdrill 4. Mix Finish 5. Cave |
Surface treatment: | ENIG, ENEPIG, OSP, HASL, Tin, Silver | Substrate: | FR4,CEM1,PI,PET,Ceramic,SUS,Glass... |
model: | high density circuit board | minute. Line width: | 0.05mm |
Copper Thickness: | 0.33oz~2oz | Board size: | 5mm~500mm |
Certificate: | RoHS/ISO9001/ISO14001 | port: | Shenzhen |
high density circuit board | special technology. | ||
place of origin; place of origin: | China | 1. Impedance 2. By filling 3.PFH, back drill 4. Mixed finishes 5. Cave 6. Radiator 7. Countersink 8. Hybrid stacking 9. ENEPIG | |
brand: | cathode ray tube | ||
Application areas: | Automotive, Industrial, Medical, Datacom, Consumer | ||
Layers: | 2~24L any layer | ||
Material: | FR4 (Tg150~Tg170) | ||
Plate thickness (mm): | 0.4mm~3.0mm | ||
Copper Thickness (oz): | 0.33oz~2oz | ||
Dimensions (mm): | 5mm~500mm | ||
minute. LW/L (mm): | 0.05/0.05 | ||
minute. Hole (mm): | 0.1 | ||
solder mask; | Green, yellow, blue, black, white... | ||
Surface treatment: | ENIG,OSP,HASL,Imm Tin,Imm Silver... | ||
Certificate: | RoHS/ISO9001/ISO14001 | ||
Serve: | OEM/DFM |