JINHUA brand manufacturer FR4 1.6mm HDI high density pcb interconnect board

Supplier: Jinhua Technology (Shenzhen) Co., Ltd.
Region: Guangdong, China
Contact: Ms Rosia Cao
Price: $3.50 / 1 - 999 pieces
$1.50 / 1000 - 4999 pieces
$0.50 / 5000 - 9999 pieces
$0.10 / >=10000 pieces
Min. Order: 1 piece

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Product details

payment terms:	L/C, Western Union, D/P, D/A, T/T, MoneyGram	type:	HDF
Origin:	Guangdong, China	Package preview:
layer:	1~20 floors	Plate thickness:	Can be customized, 1.6mm
Testing service:	100% AOI test	Supply capacity:	60000 pieces per month
MOQ:	1	Minute line spacing:	3000000
brand:	Jinhua	application:	electronic product
product name:	High Density Circuit Board	model:	JH-HDI-014
Key words:	hdi high density interconnect	Substrate:	FR4,FR4
Certificate:	ISO9001/Iso14001/CE/ROHS	Packaging Details:	Bubble bag, pearl cotton bag, anti-static bag, vacuum bag
Board Dimensions:	300*600mm, or can be customized	Serve:	hdi board services provided
Minute line width:	3000000	Surface treatment:	ENIG
Minute Hole Size:	0.15mm	Copper thickness:	1 oz
port:	Shenzhen

HDI stands for High Density Interconnect PCB. Due to their increased density, they provide an essential routing solution for large pin-count chips used in mobile devices and other high-tech products.

What types of HDI boards can you get from us?

Due to design constraints, HDI PCBs have much higher routing and pad connection densities than conventional PCBs. The structure construction is explained below.

1+N+1– The PCB contains 1 "build-up" high-density interconnect layer.

i+N+i (i ≥ 2)– The PCB consists of 2 or more "stacked" high-density interconnect layers. Microwells on different layers can be staggered or stacked.

Any layer HDI– The layers of the PCB are high-density interconnect layers that allow conductors on any layer of the PCB to freely interconnect with copper-filled stacked microvia structures.

Application of HDI PCB:

·Automobile industry:Engine control unit, GPS, dashboard electronics.

·Telecommunications Industry:Computers, Laptops, Tablets, Wearable Electronics, Internet of Things

·army:Military routers, COTS boards, etc.

· medical:35 micron trace space board, pacemaker

· Semiconductor:MCM/Flip Chip/Wire Bonding, Stacked Microvias

HDI production process:

Product Description

HDI PCB process capability
project	content	production capacity
1	layers	4-22 floors standard, 30 floors advanced
2	Material	FR4 Standard, FR4 High Performance, Halogen Free FR4, Rogers
3	Copper products	18um-70um
4	Minimum tracks and clearances	0.075mm/0.075mm
5	PCB thickness	0.4mm-6.0mm
6	biggest size	610mm*450mm, depending on the laser drilling machine
7	surface treatment	OSP, ENIG, immersion tin, immersion silver, electrolytic gold, gold finger
8	minute mechanical drill	0.15mm
9	minute laser drill	0.1mm standard, 0.075mm advanced
10	Quality Standard	IPC-600, 6012, Class II and Class III
11	HDI technology	4+N+4, 4-step arbitrary layer connection