Surface treatment: | ENIG | Plate thickness: | Can be customized, 1.6mm |
Types of: | HDF | layer: | 1~20 floors |
Packaging Details: | Bubble bag, pearl cotton bag, anti-static bag, vacuum bag | Substrate: | FR4,FR4 |
Certificate: | ISO9001/Iso14001/CE/ROHS | Minute line spacing: | 3000000 |
product name: | High Density Circuit Board | MOQ: | 1 |
Key words: | Immersion Gold High Density PCB | model: | JH-HDI-027 |
Minute line width: | 3000000 | payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram |
Supply capacity: | 60000 pieces per month | Testing service: | 100% AOI test |
application: | electronic product | brand: | Jinhua |
Copper thickness: | 1 oz | Package preview: | |
Minute Hole Size: | 0.15 mm | port: | Shenzhen |
Board Dimensions: | 300*600mm, or can be customized | place of origin; place of origin: | Guangdong, China |
Serve: | Multi-layer immersion gold high-density pcb service |
HDI stands for High Density Interconnect PCB. Due to their increased density, they provide an essential routing solution for large pin-count chips used in mobile devices and other high-tech products.
What types of HDI boards can you get from us?
Due to design constraints, HDI PCBs have much higher routing and pad connection densities than conventional PCBs. The structure construction is explained below.
1+N+1– The PCB contains 1 "build-up" high-density interconnect layer.
i+N+i (i ≥ 2)– The PCB consists of 2 or more "stacked" high-density interconnect layers. Microwells on different layers can be staggered or stacked.
Any layer HDI– The layers of the PCB are high-density interconnect layers that allow conductors on any layer of the PCB to freely interconnect with copper-filled stacked microvia structures.
Application of HDI PCB:
·Automobile industry:Engine control unit, GPS, dashboard electronics.
·Telecommunications Industry:Computers, Laptops, Tablets, Wearable Electronics, Internet of Things
·army:Military routers, COTS boards, etc.
· medical:35 micron trace space board, pacemaker
· Semiconductor:MCM/Flip Chip/Wire Bonding, Stacked Microvias
HDI production process:
HDI PCB process capability | ||
project | content | production capacity |
1 | layers | 4-22 floors standard, 30 floors advanced |
2 | Material | FR4 Standard, FR4 High Performance, Halogen Free FR4, Rogers |
3 | Copper products | 18um-70um |
4 | Minimum tracks and clearances | 0.075mm/0.075mm |
5 | PCB thickness | 0.4mm-6.0mm |
6 | biggest size | 610mm*450mm, depending on the laser drilling machine |
7 | surface treatment | OSP, ENIG, immersion tin, immersion silver, electrolytic gold, gold finger |
8 | minute mechanical drill | 0.15mm |
9 | minute laser drill | 0.1mm standard, 0.075mm advanced |
10 | Quality Standard | IPC-600, 6012, Class II and Class III |
11 | HDI technology | 4+N+4, 4-step arbitrary layer connection |