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8-layer HDI mobile phone PCB board and PCBA manufacturer

Product details
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGramplace of origin; place of origin:Guangdong, China
model:SX-5Types of:HDF
Board Dimensions:OEM ODM PCB and Assembly ServicesSurface treatment:OSP, LF HASL, Immersion Gold
Minute line spacing:3000000Copper thickness:0.5-10OZ
Package preview:product name:8-layer HDI mobile phone PCB board and PCBA manufacturer
port:ShenzhenMinute line width:3000000
Plate thickness:1.6mmSolder mask color:Green, blue, red, black, white, etc.
Substrate:FR4 materialMinute Hole Size:0.2mm
brand:Good lookingSupply capacity:100000 pieces per month

8-layer HDI mobile phone PCB board and PCBA manufacturer

Product Description

PCB: 1 to 30 layer PCB manufacturing, UL and ISO certified.

PCBA: One-stop service for PCB, sourcing components and assembly.

All PCB products are 100% visually inspected and tested to meet RoHs requirements.

our service

We provide one-stop services for PCB manufacturing, layout/design, reproduction (Gerber, BOM), component procurement, assembly (SMT, DIP, COB), advanced testing, high standard packaging, on-time delivery and after-sales service.

PCB&PCBA capability
PCB capability

 

  technical standard
layers 2-30 floors
finishing HASL Free, OSP, lmmersion gold, lmmersion silver, gold fingers
Material FR4, High Tg FR4, Rogers, Aluminum, Polyimide
Veneer Thickness 0.2mm-7.0mm
copper thickness 0.5OZ-20OZ
Minimum line width and spacing 0.075mm (3 million)
Minimum Mechanical Drill Size 0.15mm (6 million

 

PCBA capability

  technical standard
Assembly type THD, SMT, SMT&THD mixed
components Passive components, minimum size 0201, BGA, QFN, POP, fine pitch to 8 mils
bare board size

Minimum: 6.35mm*6.35mm; Maximum: 508mm*508mm

Min lC & QFN Ptich 0.012 inches (0.3 mm)
Maximum BGA size 74mm*74mm
Service type Turkey, part of Turkey or consignment
test

X-ray inspection

AOl (Automatic Optical Inspection)

ICT (In-Circuit Test/Functional Test)

equipment

 

QC

 

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