aspect ratio: | 13:1 | Minute Hole Size: | 0.15mm |
Insulation Thickness: | 0.075mm-5.0mm | biggest size: | 500mm*800mm |
Layers: | 2-16 | Minute line width: | 0.075 (three million) |
brand: | XJY | Surface treatment: | Low frequency tin spraying |
model: | MRT circuit board | Substrate: | FR4 |
Supply capacity: | 10000 pieces per month | Solder Mask: | Green, blue, red, white, black, etc. |
Certificate: | ROHS ISO9001 ISO14001 | Plate thickness: | 1.6mm |
Copper thickness: | 1 oz | test: | Automatic Optical Inspection Instrument |
type: | panel manufacturing | payment terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram, paypal |
Minute line spacing: | 5000000 | Origin: | Guangdong, China |
Packaging Details: | Packaging Details: Pcb Inner Packing: Vacuum Plastic Packing Pcb Outer Packing: Standard Caron Packing | Add the via diameter: | 0.25mm-0.60mm |
port: | Shenzhen | Package: | vacuum or carton |
Skype:ann.liu61
Shenzhen Xinjiaye Electronic Technology Co., Ltd.
thing | ability | thing | ability |
layers | 1-28 | thick copper | 1-6oz |
product type | HF (High Frequency) & (Radio Frequency) boards, impedance controlled boards, HDI Circuit board, BGA&Fine pitch board | Solder mask | Nanya&Taiyo, LPI&Matt Red, Green, Yellow, White, Blue, Black. |
Substrate | FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, Fr06, Rogers, Taconic, Argon, Naclo, Isola, etc. | Finished surface | Conventional HASL, Lead-free HASL, Flash Gold, ENIG(Immersion Gold), OSP(Entek), Immersion Tin, Immersion Sliver, Hard Gold |
selective surface treatment | EING (immersion gold) + OSP, ENIG (immersion gold) + gold finger, flash gold finger, immersion silver + gold finger, immersion tin + gold finger | ||
technical specifications | Minimum Line Width/Space | 3.5/4mil (laser drill) | |
minimum aperture | 0.15mm (mechanical drill) 4mil (laser drill) | ||
Minimum circle | 4000000 | ||
copper thickness | 6 oz | ||
Maximum production scale | 600mm*800mm | ||
plate thickness | D/S: 0.2-7.0mm, multi-layer: 0.4-7.0mm | ||
Minimum Solder Bridge | ≥0.08mm | ||
aspect ratio | 15:1 | ||
Plugging capacity | 0.2-0.8mm | ||
tolerant | Plated Hole Tolerance | ±0.08mm (minimum ±0.05) | |
Non-plated hole tolerance | ±0.05mm (minimum +0/-0.05mm or +0.05/-0mm) | ||
Profile Tolerance | ±0.15mil (minimum ±0.10mm) | ||
function test | |||
Insulation resistance | 50ohms (normal) | ||
Peel strength | 1.4N/mm | ||
Thermal Stress Test | 265℃, 20 seconds | ||
Solder Mask Hardness | 6 hours | ||
Test voltage | 500V+15/-0V 30s | ||
twist and twist |
Printed Circuit Board Characteristics
PCB Manufacturing and PCB Assembly
PCB Manufacturing Technical Requirements
PCB board test procedure
Shipping Precautions