Applied for: | water heater, fitness, LED light, Fan heater; | Copper Thickness: | 0.5oz; |
Payment Terms: | L/C,Western Union,D/P,D/A,T/T,MoneyGram,paypal; | Outer packing: | Standard carton box, with bulb package; |
Port: | shenzhen or HK; | Legend color: | white; |
Board Thickness: | 1.6mm; | Min. Line Width: | 4mil/0.1mm; |
Place of Origin: | Guangdong, China; | Min. Hole Size: | 0.2mm; |
Type: | Double Sided PCB; | Inner packing: | Vacuumn package, with dryer; |
Base material: | FR4, H-TG, Teflon, Rogers, Aluminium, copper base; | Surface Finishing: | ENIG; |
Assembly service: | OEM service to all kinds of printed circuit board assembly; | Solder mask color: | green; |
Serivice range: | engineering support, fast turn prototype, fast mass production; | Brand Name: | Wonderful PCB; |
Packaging Detail: | Our circuit board pcb packaging: vacuum packing: Inner packing: Vacuum package, with dryer Outer packing:Standard carton box, with bulb package; | Min. Line Spacing: | 0.1mm4mil); |
Model Number: | 4 Layer pcb; | Board Size: | OEM; |
Supply Ability: | 40000 Square Meters per Month; | Specialized in: | high-precision, high-density, double-sided PCB, multilayer PCBA; |
PCB Test: | Flying probe test, high-stingency 100% visual inspection; | Base Material: | FR4 TG130; |
PCB Capability | ||||||||
Number of Layer | 1 - 20 Layer | |||||||
Maximum Processing Area | 680 × 1000MM | |||||||
Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) | |||||||
4 Layer - 0.4MM ( 16 mil ) | ||||||||
6 Layer - 0.8MM ( 32 mil ) | ||||||||
8 Layer - 1.0MM ( 40 mil) | ||||||||
10 Layer - 1.1MM ( 44 mil ) | ||||||||
12 Layer - 1.3MM ( 52 mil ) | ||||||||
14 Layer - 1.5MM ( 59 mil ) | ||||||||
16 Layer - 1.6MM ( 63 mil ) | ||||||||
18 Layer - 1.8MM ( 71 mil ) | ||||||||
Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM | |||||||
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | ||||||||
Twisting and Bending | ≤ 0.75%, Min: 0.5% | |||||||
Range of TG | 130 - 215 ℃ | |||||||
Impedance Tolerance | ± 10%, Min: ± 5% | |||||||
Hi-Pot Test | Max: 4000V/10MA/60S | |||||||
Surface Treatment | HASL, With Lead, HASL Free Lead | |||||||
Flash Gold, Immersion Gold | ||||||||
Immersion Silver, Immersion Tin | ||||||||
Gold Finger, OSP |
PCB Assembly Capability | PCB Assembly Capability | |||||||
Order Quantity | 1pc – 10,000,000+pcs | |||||||
Build Time | 1 – 5 days, 1 – 2 weeks, or scheduled deliveries | |||||||
PCB Spec Requirements | PCB whose width/length is less than 30mm should be panelized Max board size: 500×450 mm Board Type: Rigid PCBs, Flexible PCBs, Metal core PCBs Surface finish: lead/lead-free HASL, ENIG, Silver, OSP | |||||||
Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control | |||||||
Solder Type | Lead-free – RoHS | |||||||
Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned | |||||||
Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire | |||||||
SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray | |||||||
Stencils | Laser-cut stainless steel | |||||||
Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |
Our advantage | ||||||||
Material Technology | Our Production | General Production | ||||||
Regular/Special | 1.Our (TG170)FR4: high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2.Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3.Our CEM no-burr 4.Our Rogers Good performance in high frequency 5.Our Aluminum Excellent heat dispersion | 1.General FR4 High heat work 2.General CEM Expand and deform in damp conditions | ||||||
Factory | We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost. | Artificial production line | ||||||
Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost | ||||||
Impedance | Good performance in reliability and stability of signal sending and receiving | High cost | ||||||
Surface Technics | 1.IMG:smooth surface, good adhesion, no oxidation under long using 2.gold plating(thick gold:1-50U"):good wear-resistance 3.HASL:better price, not easy oxidation, easy to welding, smooth surface 4.HAL: better price, not easy oxidation, easy to welding | 1.IMG:high price 2.Gold plating(thick gold):high price 3.HAL:surface is not flat, not suitable for BAG packaging | ||||||
Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM | ||||||
Multilayer board(4-20 L),BGA(CPU) | BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN width/space: 3/3MIL Multilayer board:strong microporous, high reliability | Difficult manufacturer,high cost | ||||||
Test | To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework | Careless |