Copper Thickness: | 0.25 oz - 12 oz | model: | 2 layer PCB |
Plate thickness: | 1.6mm-3.2mm 0.2mm-4.5mm | place of origin; place of origin: | Liaoning, China |
Surface treatment: | HASL/enig/OSP/Immersion Silver/Goldfinger | minute. Line spacing: | 4000000 |
Copper Thickness: | 0.25 oz - 12 oz | Impedance Control: | Yes |
brand: | GESP | Substrate: | FR-4,CEM-3, Roger, taconic,arlon , metal/ceramic/aluminum base |
payment terms: | L/C,Western Union,D/P,D/A,T/T | port: | Dalian, Shenzhen, Hong Kong |
type: | Double Sided Printed Circuit Board | Substrate: | FR-4 |
V-cut score: | Yes | Packaging Details: | Inner packing: vacuum bag Outer packing: carton |
maximum. Panel size: | twenty two | Surface treatment: | HASL lead-free/OSP/soft gold/hard gold |
minute. Line width: | 5000000 | Supply capacity: | 8000 square meters per month |
Gold thickness: | 0.05UM | minute. Hole size: | 0.15mm |
Plate thickness: | 0.005 | Certificate: | ISO/RoHS/TS16949 |
standard: | IPC Class 2, Class 3 |
ability |
standard |
advanced |
Minimum number of layers |
1 |
1 |
maximum number of layers |
12 |
40 |
Material |
FR-4 (Tg-135C, 145C, 170C), halogen free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Black FR-4 Aaron AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxies Nelco 4013 Teflon Metal core material Aluminum core |
|
plate thickness |
0.020"-0.125" |
0.005"-0.250" |
Maximum board size |
16" x 22" 12" x 21" 22" x 28" |
10" x 16" 16" x 22" 12" x 21" 22" x 28" |
copper thickness |
0.5 oz - 3 oz |
0.25 oz - 12 oz |
Minimum trace width/spacing |
0.004"/0.004" |
0.003"/0.003" |
Solder mask color |
Green, blue, black, red, yellow, white, clear and customized |
|
Silkscreen Color |
white, black, yellow, green, red, blue and customized |
|
Minimum aperture |
0.008" |
0.004" |
Finished Aperture Tolerance |
+/-0.003" |
+/-0.002" |
PCB surface treatment |
HASL (vertical and horizontal), lead-free HASL, OSP/Entek, ENIG, ENEPIG, Spray tin + gold finger, immersion tin (ISn), immersion silver (IAg), carbon Ink, hard gold (flash gold), soft gold |
|
IPC class |
level 2 |
Level 3 |
Controlled Impedance Tolerance |
+/-10% |
+/-5% |
Blind hole |
Yes |
Yes |
Buried via |
Yes |
Yes |
aspect ratio |
8/1 |
15/1 |
Minimum core thickness |
0.004" |
0.002" |
carbon ink |
Yes |
Yes |
peelable mask |
Yes |
Yes |
Solder sample |
Yes |
Yes |
first time |
Yes |
Yes |
ISO 9001:2008 |
Yes |
Yes |
ISO/TS16949:2009 |
Yes |
Yes |
UL 94v0 |
Yes |
Yes |