Finished board: | Thickness: ≤1.0MM, Tolerance: ±0.1MM | Origin: | Guangdong, China |
payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram, PayPal | Twist and bend: | ≤0.75%, min: 0.5% |
port: | Shenzhen, Hong Kong | Packaging Details: | Inner packing: vacuum packing/polybag Outer packing: standard carton packing |
Board size: | Processing | Certificate: | ISO9001.ROSH.UL |
Supply capacity: | 45000 square meters wonderful aluminum PCB manufacturer per month | Surface treatment: | Leaded/lead-free HASL, immersion gold, silver, OSP |
Maximum processing area: | 680×1000MM | minute. line width: | 0.1 mm |
Substrate: | aluminum | Silk screen color: | black, white, red, green |
brand: | Wonderful PCB | Thermogravimetric range: | 130-215℃ |
Serve: | One-stop OEM service | MOQ: | 1 |
Plate thickness: | 0.3mm- 4mm | Copper thickness: | 0.3 - 6 oz |
Layers: | 1-28 floors | type: | Aluminum plate |
thing: | Excellent aluminum substrate manufacturer | model: | wonderful aluminum substrate |
minute. Hole size: | 0.2mm | minute. Line spacing: | 0.1 mm |
Our advantage | ||||||||
material technology | our production | General production | ||||||
regular/special | 1. Our (TG170) FR4: High-quality materials, excellent heat resistance, no deformation and fracture at high temperature, no foaming, no burning, good performance Chargeability, impact resistance, moisture resistance 2. Our FR4 Good performance of electrification, impact resistance and moisture resistance 3. Our CEMs No glitch 4. Our Rogers good high frequency 5. Our aluminum Excellent heat dissipation | 1. General FR4 Hot work 2. General CEM Swells and deforms in wet conditions | ||||||
factory | We have automatic production lines. The automated production line improves the accuracy and efficiency of PCB production, making The surface is cleaner and smoother, which is beneficial to reduce costs. | Manual production line | ||||||
Blind/Buried Via Board, High Density Interconnection (1+1, N+1) | The application of HDI technology reduces the thickness and volume of the PCB board and increases the density of 3D wiring design. | Production is difficult and costly | ||||||
impedance | Good reliability and stability of signal sending and receiving | high cost | ||||||
Surface Technology | 1. IMG: smooth surface, good adhesion, long-term use without oxidation 2. Gold plating (thick gold: 1-50U"): good wear resistance 3. HASL: better price, not easy to oxidize, easy to weld, smooth surface 4. HAL: better price, not easy to oxidize, easy to weld | 1. IMG: high price 2. Gold plating (thick gold): high price 3. HAL: The surface is uneven, not suitable for BAG packaging | ||||||
Copper hole/surface (20-25UM,0.5-60Z) | Laser drilling: minimum 0.1MM, mechanical drilling: minimum 0.2MM | It is difficult to reach 0.1MM | ||||||
Multi-layer board (4-20L), BGA (CPU) | BGA: high density, high performance, multi-function, increased thermal reliability, good electrothermal performance, MIN Width/Space: 3/3MIL Multi-layer board: strong micro-hole, high reliability | Production is difficult and costly | ||||||
test | Guarantee quality, avoid waste after installation, save cost and rework time | careless |