0.635 mm 96% AL2O3 ceramic PCB with printed resistors printed directly on board

Supplier: Shenzhen Danyu Electronics Co., Ltd.
Region: Guangdong, China
Contact: Mr Peter Gui
Price: $1.99 / 100 - 499 pieces
$1.49 / >=500 pieces
Min. Order: 100 pieces

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Product details

Copper thickness:	10-20 microns	Substrate:	AlN/Si3N4/Al2O3(96%)/ZTA(ZrO29%)
Origin:	Guangdong, China	Packaging Details:	10pcs/box, 10boxes/carton
Solder Mask:	No	product name:	AMB ceramic PCB
minute. Line spacing:	0.15 mm	brand:	Danyu
model:	DSC00509	Plate thickness:	0.635mm
type:	Ceramic PCB	Silkscreen:	No
minute. Hole size:	0.10 mm	Operating temperature:	-55℃~650℃
Maximum Copper Thickness:	800 microns	Board size:	Customization
Surface treatment:	ENEPIG	Material:	Silicon nitride
Certificate:	ISO13485/IATF16949/ISO9001/UL	Copper thickness:	0.6 mm (600 microns)
Shipping method:	DHL UPS EMS TNT FedEx	minute. line width:	0.15 mm
port:	Yantian	application:	New energy vehicle IGBT module
payment terms:	Western Union, T/T

Product Description

The conductor thickness of this ceramic PCB is 5-7um gold paste

This is a ceramic PCB made with AMB (Active Metal Brazing) technology with very thick copper

This AMB ceramic PCB with plated through holes

This ceramic PCB substrate is 0.635mm 96% AL2O3

Compared with DBC technology, AMB technology has stronger thermal conductivity, heat resistance and impact resistance

The ceramic PCB is double-sided

This is a very good and suitable ceramic PCBmedical device

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thing	Thick film capability	DCB/DBC capability	data transfer capability	Magnetic Bearing Capability
layers	10 floors	2 layer	2 layer	2 layer
board size	200*200mm	138*178mm	138*190mm	114*114mm
Minimum plate thickness	0.25 mm	0.30mm~0.40mm	0.25 mm	0.25 mm
Maximum plate thickness	2.0 mm	1L: 1.3mm; 2L: 1.6mm	2.0 mm	1.8 mm
Conductor Thickness	5 microns - 13 microns	3.9 oz - 8.6 oz	2 microns-200 microns	8 oz - 22.9 oz
Minimum Line Width/Space	6/8 mil (0.15/0.20 mm)	12/12 mil (0.30/0.30mm)	6/8 mil (0.15/0.20 mm)	20/20 mil (0.50/0.50 mm)
Substrate type	AI203, ALN, BeO, ZrO2	AI203, ALN, ZrO2	AI203, ALN, ZrO2, Si3N4	Aluminum Nitride, Silicon Nitride
Substrate thickness	0.25, 0.38, 0.50, 0.635, 0.80,	0.25, 0.38, 0.50, 0.635, 0.76,	0.25, 0.38, 0.50, 0.635, 0.80,	0.25, 0.38, 0.50, 0.635, 0.76,

		1.0, 1.25, 1.5, 2.0mm	1.0 mm	1.0, 1.25, 1.5, 2.0mm	1.0mm
minimum aperture	4 million (0.1mm)
Minimum pitch	NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Minimal pad ring (single)	6 million (0.15mm)	not applicable	3 million (0.075mm)	not applicable
Plated Through Hole Wall Thickness	4 million (10 microns)	not applicable	4 million (10 microns)	not applicable
Minimum Pad Diameter	10 million (0.25mm)	8 million (0.20mm)	6 million (0.15mm)	8 million (0.20mm)
Minimum Solder Bridge	12 million (0.30mm)	8 million (0.20mm)	6 million (0.15mm)	8 million (0.20mm)
Minimum BAG PAD margin	12 million (0.30mm)	8 million (0.20mm)	5 million (0.125mm)	8 million (0.20mm)
PTH/NPTH diameter tolerance	Plated Through Hole: ±4 mil (0.1 mm); NPTH: ±2 mil (0.05 mm)
Hole position deviation	± 4 mil (0.1 mm)
Shape Tolerance	Laser: +0.2/0.05mm;	Laser: +0.2/0.05mm	Laser: +0.2/0.05mm;	Laser: +0.2/0.05mm

			Die: +0.25/0.20mm			Die: +0.25/0.20mm
Line Width/Space Tolerance	± 5 mil (0.125 mm)	± 5 mil (0.125 mm)	± 1 mil (0.025 mm)	± 5 mil (0.125 mm)
surface treatment	Silver palladium, gold palladium, manganese/nickel	OSP/nickel plating, ENIG	OSP/ENIG/ENEPIG	OSP/nickel plating, ENIG
Thermal Stress	1 hour @350℃	3 x 10 sec @ 280°C	15 minutes @350℃	3 x 10 seconds @ 280°C