Cleaning angle: | Disposable | Gross weight per piece: | 1.000 kg |
product name: | Solder paste 500g No-clean solder paste flux | Operating temperature: | 240 |
Single pack size: | 10X20X30 cm | Sales unit: | single product |
Viscosity: | 190 | Particle count: | 20-45 |
alloy composition: | SnBi, SbBiAg, SnAgCu | Origin: | China |
application: | Repair Phone/Soldering Station | activation: | return authorization |
Packaging Details: | OPP bag or customized packing | usage: | Reflow oven, electronic component installation |
weight: | 500 g |
Solder paste 500g high/medium/low temperature halogen-free lead-free no-clean solder paste flux
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Delivery time: 2-7 days
Shipping method: DHL/UPS/FEDEX/ETC (express/sea/air/train)