payment terms: | D/A, T/T, Western Union, MoneyGram | BGA solder balls: | usable |
brand: | mechanical | Supply capacity: | 100 sets per month |
Origin: | Guangdong, China | Packaging Details: | carton |
Function: | suitable for welding | product name: | Flux paste |
port: | Shenzhen, Guangzhou, Yiwu | delivery time: | stock available |
BGA reballing tool: | usable | price: | Negotiable |
Model: | Mechanical XGSP30 | MOQ: | 1 bottle |
weight: | 100G/bottle | application: | For BGA reballing |
MECHANIC solder Paste XGSP30 Sn63/Pb37 solder Paste Flux Medium Temperature Solder Paste Mobile phone PCB repair
Model | Mechanical Solder Paste |
Material |
tin-lead alloy
|
melting point |
183 degrees Celsius
|
certified
|
RoHS Compliant
|
wettability
|
Bright and uniform solder joints
|
Printability
|
Eliminate pits and knots missed during printing
|
feature
|
Reflow soldering does not produce solder balls and solder bridges
|
service life
|
It can be printed continuously for more than ten hours at room temperature without producing tin beads
|
application
|
Radiator module welding & LED welding & high frequency welding
|
gross weight |
About 16.0-60.0g/pc
|