application: | For BGA Re-Ball Rework | weight: | 100G/bottle |
BGA ball return tool: | usable | BGA solder balls: | usable |
Supply capacity: | 100 sets per month | Minimum order quantity: | 1 bottle |
payment terms: | D/A,T/T,Western Union,MoneyGram | Function: | Suitable for soldering |
delivery time: | stock available | brand: | mechanical |
place of origin; place of origin: | Guangdong, China | port: | Shenzhen, Guangzhou, Yiwu |
Model: | mechanical | Packaging Details: | carton |
product name: | Flux Paste | price: | Negotiable |
MECHANIC original solder paste 183C melting point solder paste Sn63/Pb37
Model | Mechanical Solder Paste |
Material |
Tin-lead alloy
|
melting point |
183 degrees Celsius
|
Certification
|
RoHS Compliant
|
wettability
|
Bright and uniform solder joints
|
printability
|
Eliminate missing pits and knots during printing
|
feature
|
Reflow soldering does not produce solder balls and solder bridges
|
service life
|
Can print continuously for more than ten hours at room temperature without tin beading
|
application
|
Radiator Module Welding & LED Welding & High Frequency Welding
|
gross weight |
About 16.0-60.0g/pcs
|