SAC305 Solder Paste Lead Free Solder Paste Sn96.5Ag3.0Cu0.5

Advantage 1.

Less Residue, higher insulation resistance.

With No-clean Flux, after soldering, there no residue at the surface of the product. Also can keep a transparent appearance and high insulation resistance.

Advantage 2.

Suitable viscosity, no collapse and excursion.

By using our own formula and environmental friendly soldering Flux, our solder paste can keep very good Thixotropic Behavior and stable viscosity. Also our solder paste have excellent Thermal collapse protection, this will privide quality guarantee for production.

Advantage 3

Strong wettability, high Tin climbing performance.

The Wettability and Tin Climbing performace will decide the Soldering  quality. 

Also we have strong grinding machine, can provide different size Solder Powder. Diameter of the powder from 5μm~75μm available. Suitbale for different kinds production requirements.

Advantage 4.

Directly manufacturer and dust-free plant.

Our factory lcated in Shenzhen-China, we have our own factory to manufacturing Soldering Wire/Solder Bar. 

And also a separate Solder Paste plant which with Dust-free working room. To make sure the products are clean and purity.

Also we cooperate with the biggest mine field provider in China, to ensure our stable and fresh raw material supply.

Solder Paste Applications.

Sn97.5/Ag2.0/Cu0.5  solder paste is widely used in PCB, BGA, CSP and welding repair. We have 2 types as low halogen and halogen free . Can reach industry standards. With oxide layer for rapid removal of metal surface, components and storn metal bonding performance, Non-conductive insulation, fast wetting, less smoke, less residue. We also prodcue many models such as high temperature solder paste, low temperature solder paste, middle temperature solder paste, solder paste flux,

Tin lead solder paste, Sn63Pb37, Sn60Pb40, Sn50Pb50, Sn62.8Ag0.4Pb36.8, Sn62.9/Pb36.9/Ag0.2, lead free solder paste, low halogen solder paste and halogen free solder paste, solder paste flux. 

It is widely used for these: Laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect.

Transport.

For Solder Paste transportation, better by air. And the transport time better less than 5 weeks. 

Begin Using.

Once get the solder paste, it should be kept at refrigerator and keep for 2~4 hours before begin normal production.

And solder paste removed from cold storage, do not open immediately, to prevent fogging, must be left at room temperature (2-4 hours) and the solder paste temperature back to 25 ℃ before open storage use.

Storage.

After use, the solder paste must be stored in a clean and pollution-free empty bottle, sealed and stored in a cold storage, and cannot be mixed with the new solder paste. The preservation period of the solder paste after opening is 6 days. If the storage period exceeds 6 days, please discard it to ensure its production quality.

Also there is the Expiry Time with different temperature: 

0-10℃: 6 months (Seal Storage)
>10℃: 15 days   (Seal Storage)
After open: 6 days  (Seal Storage)

Attention.

Be infected with hands and feet carelessly, rinse with soap and water immediately, do not knead with hand, a few remain can be swabbed with alcohol.

Reflow Oven.

Setting different temperatures based on different alloy and machines features. Also need to consider pcb layout, circuit width then to adjust the processing temperature.

Here are the recommended parameters for reflow oven.

(1)Ramp to Reflow: Ramp Speed set at 1℃~3℃/second, At preheating zone, if the temperature ramp to fast will break the solder paste's mobility and components. This will arise Tin Blasting and tin ball problems.

(2)Preheating Zoon: Temperature better at 140~170℃, time at 80~150 seconds. If temperature is too low, there will make solder not fully melting problem.

(3)Reflow: Peak Temp. Setting at 210℃~230℃. While Temp. ≥183℃, time set at 60~100 seconds. ≥200℃ set at 40~80 seconds.

(4)Cooling: Cooling Speed <4℃/second.