Packaging Details: | Vacuum packing, carton packing, anti-static packing, according to customer | deliver goods: | UPS or TNT or DHL or Fedex |
minute. Line width: | 0.05mm | type: | circuit board |
brand: | HT | Certificate: | ISO,Rohs,CE |
Industrial computer standard: | Level 2 / Level 3 | minute. Hole size: | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Silkscreen Color: | white, yellow, black | Plate thickness: | 0.2-7.0mm (≤0.2mm to be reviewed) |
Substrate: | aluminum base | Copper Thickness: | 0.5-6OZ |
PCBA service: | SMT/SMD, DIP, BGA, COB Component Assembly, Enclosure and Cable Assembly | model: | A printed circuit board |
payment terms: | Western Union, T/T, Paypal or Cash | minute. Line spacing: | 0.05mm |
Board size: | 200*300mm | port: | Shenzhen/Hong Kong |
Layers: | 1-40 (≥30 layers need to be reviewed) | Supply capacity: | 1,000,000 square meters/month |
Solder mask: | Green, Yellow, Black, Blue, Red, White, Matte Green | Surface treatment: | Spray tin, OSP, lead-free spray tin, immersion silver |
place of origin; place of origin: | Guangdong, China |
sequence | thing | ability |
1 | substrate | FR-4, High TG FR-4, Halogen Free, CEM-3, CEM-1, PTFE, Rogers, Arlon, Taconic, Aluminum Base, PI, etc. |
2 | layer | 1-40 (≥30 layers need to be reviewed) |
3 | Finished inner/outer copper thickness | 0.5-6OZ |
4 | Maximum panel size | ≤2-sided PCB: 600*1500mm Multilayer board: 500*1200mm |
5 | Minimum wire width/spacing | Inner layer: ≥3/3mil Outer layer: ≥3.5/3.5mil |
6 | warping | Plate thickness≤0.79mm: β≤1.0% 0.80≤plate thickness≤2.4mm: β≤0.7% Plate thickness≥2.5mm: β≤0.5% |
7 | controlled impedance | +/- 5 % Ω(<50Ω), +/-10%(≥50Ω), ≥50Ω+/-5% (requires review) |
8 | Minimum Solder Ring | 4000000 |
9 | Pore blocking ability | 0.2-0.8mm |
10 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
Orbotech Ves machine: 0.05-6.0mm, max 23.5*23.5inch |