JIAKANG 5245MHz 5G Wifi Dielectric Ceramic Filter

Items

Requirement

Withstand DC Voltage

50V (1min max)

Insulation Resistance  MΩ min.

100(10V,1min±5s)

Storage temperature

-40℃~85℃

Operation Temperature Range ℃

-40 to +85

Items

Requirement

Center frequency MHz

5245

Bandwidth [BW] MHz

5150-5340

Insertion Loss in BW dB max

2.5

Ripple in BW dB max

1.3

Return loss. in BW min.

10

Attenuation[Absolute Value] dB min

33 min.@ 5490MHz

36 min.@ 5530MHz

                  40 min.@ 5610MHz

Input Power  W  max.

1

In/Out Impedance ohm

50

No.

Item

Test Condition

Remark

5.1

Humidity Test

The device is subjected to 90%~95% relative humidity 40℃±2℃ for 96h~98h,then dry out at 25℃±5℃ and less than 65% relative humidity for 2h~4h. After dry out the device shall satisfy the specification in table 1.

It shall fulfill the specifications

in Table 1.

5.2

High  

Temperature

Exposure

The device shall satisfy the specification in table 1 after leaving at 85℃ for 16h,provided it would be measured after 2h~4h leaving in 25℃±5℃ and less than 65% relative humidity.

It shall fulfill the specifications

in Table 1.

5.3

Low

Temperature

The device shall satisfy the specification in table 1 after leaving at- 40℃ for16h,provided it would be measured after 2h~4h leaving in 25℃±5℃ and less than 65% relative humidity.

It shall fulfill the specifications

in Table 1.

5.4

Temperature

Cycle

Subject the device to -25℃ for 30 min. followed by a high temperature of 85℃ for 30 min cycling shall be repeated 5 times. At the room temperature for 1h~4h prior to the measurement.

It shall fulfill the specifications

in Table 1.

5.5

Vibration

Subject the device to vibration  for 2h each in x,y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10Hz~55Hz.

It shall fulfill the specifications

in Table 1.

5.6

Soldering Test

The device should be satisfied after preheating at 120℃~150℃ for 60seconds and dipping in soldering Sn an 260℃±5℃ for 10±1 seconds.

Mechanical damage shall not occur.

5.7

Solder

Ability

Dipped in 250℃±5℃ solder bath for 3s±0.5 s with rosin flux (25wt% ethanol solution.)

The terminals shall be at least 95% covered by solder.

5.8

Terminal

Pressure Strength

The device is subjected to be soldered to be soldered on test PCB .Then apply 5N of force for 10s±1s in the direction of the arrow.

Mechanical damage such as breaks shall not occur.

Item

Characteristics after test

Insertion Loss Change dB max

±0.3

Ripple dB max

±0.3

Attenuation Change dB min

±2.0

Note:The limits in the above table are referenced to the initial measurements.

Phase

Profile features

Pb-Free Assembly

PREHEAT

-Temperature Min
-Temperature Max
-Time form

150℃

200℃

60-120 seconds

RAMP-UP

Avg. Ramp-up Rate 200℃

 to 260℃)

3℃/second(max)

REFLOW

-Temperature

-Total Time above 220℃

220℃

30-100 seconds

PEAK

-Temperature
-Time

260℃

8 seconds

RAMP-DOWN

Rate

2-6℃/second

Time from 25℃ to Peak Temperature

8 minutes max

Composition of solder paste

Ag3.0/Cu0.5/ Sn

NO.

Name

Quantity

1

Inner  Box

1

2

QC Label

1

3

Label

1